Characterization of the chemical bond in novel materials by the study of the acoustic signature

被引：2

作者：

Cros, B ^{[1
]}

Ferrandis, JY ^{[1
]}

Despaux, G ^{[1
]}

机构：

[1] Univ Montpellier 2, LAIN, F-34095 Montpellier 05, France

来源：

SENSORS AND ACTUATORS B-CHEMICAL | 2001年 / 76卷 / 1-3期

关键词：

acoustic signature; cross-linkage; silicon carbide; thin layers; minicomposites; adhesion;

D O I：

10.1016/S0925-4005(01)00595-0

中图分类号：

O65 [分析化学];

学科分类号：

070302 [分析化学]; 081704 [应用化学];

摘要：

Acoustic signature is processed by using focalized high frequency acoustic sensors. Through the knowledge of surface wave velocities, very sensitive to the material features, it provides local quantitative information on the elastic properties. This information was related to the chemical bonds in a-SiC:H thin films, in SiC/SiC minicomposites, in cross-linked photopolymers and at an aluminum/poly(ethylene terephtalate) (PET) interface. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：108 / 114

页数：7

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