Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow

被引：42

作者：

Alam, MO ^{[1
]}

Chan, YC ^{[1
]}

Hung, KC ^{[1
]}

机构：

[1] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 10期

关键词：

reflow; electroless Ni-P; intermetallic compound; amorphous; crystallization;

D O I：

10.1007/s11664-002-0051-5

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The interfaces between electroless Ni-P deposit and Pb-Sn solder and Sn-Ag solder were formed by reflowing for different time periods to examine their microstructures and microchemistry. It was found that the Pb-Sn solder interface is more stable than the Sn-Ag solder interface. Sn-Ag solder reacts quickly with the electroless Ni-P deposit and forms nonadherent Ni-Sn intermetallic compounds (IMCs). Pb-Sn solder reacts slowly and forms adherent Ni-Sn IMC. A P-rich Ni layer, revealed as a dark layer under scanning electron microscopy (SEM), is formed on the electroless Ni P deposit due to the solder reaction. For short reflow times, this P-rich Ni layer consists of only Ni3P compound, but during prolonged reflow, new crystals of Ni2P, Ni5P4, and NiP2 are also found to be formed from the amorphous electroless Ni-P layer.

引用

页码：1117 / 1121

页数：5

共 29 条

[1] Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints [J].

Chan, YC ;

Tu, PL ;

So, ACK ;

Lai, JKL .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (04) :463-469

[2] Growth kinetic studies of Cu-Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints [J].

Chan, YC ;

So, ACK ;

Lai, JKL .

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 1998, 55 (1-2) :5-13

[3] Interfacial reactions in Ag-Sn/Cu couples [J].

Chen, SW ;

Yen, YW .

JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1203-1208

[4] Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate [J].

Choi, WK ;

Lee, HM .

JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1251-1255

[5] XRD, XPS and SIMS investigations on electrodeposited nickel-phosphorous alloy coatings [J].

Haseeb, ASMA ;

Chakraborty, P ;

Ahmed, I ;

Caccavale, F ;

Bertoncello, R .

THIN SOLID FILMS, 1996, 283 (1-2) :140-144

[6]

HERDON VA, 2001, WORKSH LEND FREE PRO

[7] Reaction kinetics of solder-balls with pads in BGA packages during reflow soldering [J].

Ho, CE ;

Chen, YM ;

Kao, CR .

JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1231-1237

[8] Correlation between Ni,Sn, intermetallics and Ni3P due to solder reaction-assisted crystallization of electroless Ni-P metallization in advanced packages [J].

Hung, KC ;

Chan, YC ;

Tang, CW ;

Ong, HC .

JOURNAL OF MATERIALS RESEARCH, 2000, 15 (11) :2534-2539

[9] SOLDER BUMP FORMATION USING ELECTROLESS PLATING AND ULTRASONIC SOLDERING [J].

INABA, M ;

YAMAKAWA, K ;

IWASE, N .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (01) :119-123

[10] Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology [J].

Jang, JW ;

Kim, PG ;

Tu, KN ;

Frear, DR ;

Thompson, P .

JOURNAL OF APPLIED PHYSICS, 1999, 85 (12) :8456-8463

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