Reel-to-Reel Copper Electroplating on Pulse Laser Deposition Coated Conductor

被引:12
作者
Floegel-Delor, Uta [1 ]
Riedel, Thomas [1 ]
Wippich, Dieter [1 ]
Goebel, Bernd [1 ]
Rothfeld, Rolf [1 ]
Schirrmeister, Peter
Werfel, Frank N. [1 ]
Usoskin, Alexander [2 ]
Rutt, Alexander [2 ]
机构
[1] Adelwitz Technol Zentrum GmbH ATZ, Arzberg, Germany
[2] BRUKER HTS, Alzenau, Germany
关键词
Contact resistance; copper plating; PLD; reel-to-reel; YBCO coated conductor;
D O I
10.1109/TASC.2010.2101031
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];
摘要
By applying high-rate copper electroplating technique the reliable fabrication of a copper stabilizer on coated conductor with an 1 mu m Ag cap is investigated. The obtained mechanical, electrical and encapsulation properties due to a 20 mu m thick Cu stabilizer on the surface improve the practical and technical performance. A copper sulphate CuSO4 based pulse plating technique is capable to deposit a 20 micrometer thick copper layer in a fast and continuous non-vacuum process. A surround Cu layer protects the HTS conductor surface against salt aqueous solutions, humidity, and against cryogenic liquids LN2 and liquid helium. With the copper stabilizer conductor solder joining with a contact resistance of 200 n Omega cm(2) becomes possible. Further effort is being made to develop and construct a high-rate and high throughput continuous reel-to-reel modular plating unit for deposition of long length (>400 m). The paper describes the practical achievements within the conductor fabrication.
引用
收藏
页码:2984 / 2987
页数:4
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