Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure

被引：39

作者：

Abhari, R ^{[1
]}

Eleftheriades, GV ^{[1
]}

机构：

[1] Univ Toronto, Edward S Rogers Sr Dept Elect & Comp Engn, Toronto, ON M5S 3G4, Canada

来源：

2002 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3 | 2002年

关键词：

D O I：

10.1109/MWSYM.2002.1011664

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A novel approach for the suppression of the parallel-plate noise in high-speed circuits is proposed by utilizing a metallic electromagnetic band-gap (EBG) structure. The key idea relies on replacing one of the two solid electric conductor plates with a metallic EBG surface of compact texture. To validate the concept, an EBG surface was fabricated and employed in a number of via-containing parallel-plate test boards. Frequency domain measurements showed a band-gap of about 1.7 GHz around 3.77 GHz. More importantly, suppression of the parallel-plate noise by 65% was achieved based on time domain reflectometry experiments.

引用

页码：493 / 496

页数：4

共 6 条

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