Application of rigorous electromagnetic simulation to SLM-based maskless lithography for 65nm node

被引:9
作者
Croffie, E [1 ]
Eib, N [1 ]
Callan, N [1 ]
BabaAli, N [1 ]
Latypov, A [1 ]
Hintersteiner, J [1 ]
Sandstrom, T [1 ]
Bleeker, A [1 ]
Cummings, K [1 ]
机构
[1] LSI Log Corp, Gresham, OR 97030 USA
来源
23RD ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, PTS 1 AND 2 | 2003年 / 5256卷
关键词
maskless lithography; tilt mirror; rigorous simulation; light scattering; 65 nm lithography; SLM; TEMPEST;
D O I
10.1117/12.518747
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
Maskless lithography imaging based on SLM tilt mirror architecture requires illumination of light on a non-planar reflective topography. While the actual mirror dimensions can be much larger than the wavelength of light, the spacing between mirrors and the tilt range of interest are on the order of the wavelength. Thus, rigorous electromagnetic solution is required to capture light scattering effects due to the non-planar topography. We combine high NA imaging simulation with rigorous simulation of light scattering from the mirrors to study its effects on 65nm maskless lithography imaging. We vary mirror size, mirror tilt arrangement, feature type and illumination settings and compare the rigorous light scattering imaging results with standard imaging simulations using Kirchoff approximation. While electromagnetic scattering effects are present in the form of lateral standing waves and edge streamers in reflected light near-field intensity, they have negligible effects on SLM imaging for mirror sizes more than 1mum(2). The effects of mirror tilt arrangement on diffraction orders are used to study the through-focus behavior of alternating rows arrangement used in the SIGMA maskwriters as well as alternative arrangements. The good imaging properties of the alternating rows arrangement are confirmed and a multipass overlay scheme giving further image fidelity improvements is suggested.
引用
收藏
页码:842 / 850
页数:9
相关论文
共 12 条
[1]  
CHEN YJ, TECHN P 3 NAT C MOD, P602
[2]   Rigorous EM simulation of the influence of the structure of mask patterns on EUVL imaging [J].
Deng, YF ;
La Fontaine, B ;
Levinson, HJ ;
Neureuther, AR .
EMERGING LITHOGRAPHIC TECHNOLOGIES VII, PTS 1 AND 2, 2003, 5037 :302-313
[3]   Rigorous diffraction analysis for future mask technology [J].
Erdmann, A ;
Friedrich, C .
OPTICAL MICROLITHOGRAPHY XIII, PTS 1 AND 2, 2000, 4000 :684-694
[4]   Design and analysis of manufacturable alternating phase-shifting masks [J].
Gordon, RL ;
Mack, CA ;
Petersen, JS .
18TH ANNUAL SYMPOSIUM ON PHOTOMASK TECHNOLOGY AND MANAGEMENT, 1998, 3546 :606-616
[5]   Simulation of imaging and stray light effects in immersion lithography [J].
Hafeman, S ;
Neureuther, AR .
OPTICAL MICROLITHOGRAPHY XVI, PTS 1-3, 2003, 5040 :700-712
[6]  
LEE D, 1995, 79513 UCBERL
[7]   Rigorous simulation of mask corner effects in extreme ultraviolet lithography [J].
Pistor, TV ;
Adam, K ;
Neureuther, A .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1998, 16 (06) :3449-3455
[8]  
SANDSTROM T, 2003, INT SOC OPT ENG OPT
[9]  
SHROFF Y, 2003, P SOC PHOTO-OPT INS, V5040, P550
[10]  
WONG A, 1994, RIGOROUS 3 DIMENSION