A periodic array of silicon pillars fabricated by photoelectrochemical etching

被引:25
作者
Li, Xiaopeng [1 ]
Seo, Hong-Seok [1 ]
Um, Han-Don [1 ]
Jee, Sang-Won [1 ]
Cho, YongWoo [1 ]
Yoo, Bongyoung [1 ]
Lee, Jung-Ho [1 ]
机构
[1] Hanyang Univ, Div Mat & Chem Engn, Ansan 426791, Kyounggi Do, South Korea
关键词
Photoelectrochemical etching; Silicon pillar array; Pore separation; Macroporous silicon; KOH post-etching; ALKALINE-SOLUTIONS; MECHANISM; PORE;
D O I
10.1016/j.electacta.2009.06.094
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
A periodic array of silicon pillars was photoelectrochemically fabricated using the two-step etching process with a n-type Si (1 0 0) substrate. Two key factors, backside illumination and anodic bias, were required to obtain a high-aspect ratio macropore array of silicon. It was found that the initial pore could be separated into two different pores when the applied anodic bias was greater than a certain critical value. The pore size of the macroporous silicon with a high porosity was increased by anisotropic etching in an alkaline solution. Due to destruction of the pore sidewalls, KOH etching allowed for the fabrication of silicon pillars on a large-scale wafer with an improved uniformity. The anisotropic etching behavior of KOH solution led to necking of the silicon pillars when the etching time exceeded 60 s. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:6978 / 6982
页数:5
相关论文
共 28 条
[1]   Electrochemical etching in HF solution for silicon micromachining [J].
Barillaro, G ;
Nannini, A ;
Piotto, M .
SENSORS AND ACTUATORS A-PHYSICAL, 2002, 102 (1-2) :195-201
[2]   SILICON QUANTUM WIRE ARRAY FABRICATION BY ELECTROCHEMICAL AND CHEMICAL DISSOLUTION OF WAFERS [J].
CANHAM, LT .
APPLIED PHYSICS LETTERS, 1990, 57 (10) :1046-1048
[3]   High-throughput design and fabrication of an integrated microsystem with high aspect-ratio sub-micron pillar arrays for free-solution micro capillary electrophoresis [J].
Chan, YC ;
Lee, YK ;
Zohar, Y .
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2006, 16 (04) :699-707
[4]   Formation and application of porous silicon [J].
Föll, H ;
Christophersen, M ;
Carstensen, J ;
Hasse, G .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2002, 39 (04) :93-141
[5]   Growth of vertically aligned Si wire arrays over large areas (>1 cm2) with Au and Cu catalysts [J].
Kayes, Brendan M. ;
Filler, Michael A. ;
Putnam, Morgan C. ;
Kelzenberg, Michael D. ;
Lewis, Nathan S. ;
Atwater, Harry A. .
APPLIED PHYSICS LETTERS, 2007, 91 (10)
[6]   Toward the formation of three-dimensional nanostructures by electrochemical etching of silicon [J].
Kleimann, P ;
Badel, X ;
Linnros, J .
APPLIED PHYSICS LETTERS, 2005, 86 (18) :1-3
[7]   Formation of three-dimensional microstructures by electrochemical etching of silicon [J].
Kleimann, P ;
Linnros, J ;
Juhasz, R .
APPLIED PHYSICS LETTERS, 2001, 79 (11) :1727-1729
[8]   HIGH-ASPECT-RATIO SUBMICRON SILICON PILLARS FABRICATED BY PHOTOASSISTED ELECTROCHEMICAL ETCHING AND OXIDATION [J].
LAU, HW ;
PARKER, GJ ;
GREEF, R ;
HOLLING, M .
APPLIED PHYSICS LETTERS, 1995, 67 (13) :1877-1879
[9]   FORMATION MECHANISM AND PROPERTIES OF ELECTROCHEMICALLY ETCHED TRENCHES IN N-TYPE SILICON [J].
LEHMANN, V ;
FOLL, H .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (02) :653-659
[10]   THE PHYSICS OF MACROPORE FORMATION IN LOW DOPED N-TYPE SILICON [J].
LEHMANN, V .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1993, 140 (10) :2836-2843