Effect of Al-trace degradation on Joule heating during electromigration in flip-chip solder joints

被引：21

作者：

Liang, S. W. ^{[1
]}

Chiu, S. H. ^{[1
]}

Chen, Chih ^{[1
]}

机构：

[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 30050, Taiwan

来源：

APPLIED PHYSICS LETTERS | 2007年 / 90卷 / 08期

关键词：

D O I：

10.1063/1.2644061

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

This study investigates the mechanism for the abrupt increase in temperature at later stages of electromigration in flip-chip solder joints. It is found that electromigration also occurs in Al traces when stressed by 0.6 A at 100 degrees C. Three-dimensional thermoelectrical simulation by finite element analysis was carried out to simulate the temperature distribution in solder joints with and without degradation of the Al trace. It is found that the degradation of the Al trace has substantial effect on the Joule heating of solder joints. This model can explain the serious Joule heating effect in the later stages of electromigration. (c) 2007 American Institute of Physics.

引用

页数：3