Fabrication and effective thermal conductivity of multi-walled carbon nanotubes reinforced Cu matrix composites for heat sink applications

被引:217
作者
Chu, Ke [1 ,2 ]
Wu, Qingying [1 ]
Jia, Chengchang [1 ]
Liang, Xuebing [1 ]
Nie, Junhui [1 ]
Tian, Wenhuai [2 ]
Gai, Guosheng [3 ]
Guo, Hong [4 ]
机构
[1] Univ Sci & Technol Beijing, Inst Powder Met, Beijing 100083, Peoples R China
[2] Univ Sci & Technol Beijing, Dept Mat Phys & Chem, Beijing 100083, Peoples R China
[3] Tsinghua Univ, Dept Mat Sci & Engn, Beijing 100084, Peoples R China
[4] Beijing Gen Res Inst Nonferrous Met, Beijing 100088, Peoples R China
关键词
Metal-matrix composites; Carbon nanotubes; Thermal properties; Powder processing; Sintering;
D O I
10.1016/j.compscitech.2009.10.021
中图分类号
TB33 [复合材料];
学科分类号
080505 [复合材料];
摘要
A novel particles-compositing method was used for the first time to disperse different contents of multiwalled carbon nanotubes (CNTs) in micron sized copper powders, which were subsequently consolidated into CNT/Cu composites by spark plasma sintering (SPS). Microstructural observations showed that the homogeneous distribution of CNTs and dense composites could be obtained for 0-10 vol.% CNT contents. The CNT clusters were appeared in the powder mixture with 15 vol.% CNTs, which resulted in an insufficient densification of the composites. The effective thermal conductivity of the composites was analyzed both theoretically and experimentally. The addition of CNTs showed no enhancement in overall thermal conductivity of the composites due to the interface thermal resistance associated with the low phase contrast of CNT to copper and the random tube orientation. Besides, the composite containing 15 vol.% CNTs led to a rather low thermal conductivity due possiblely to the combined effect of unfavorable factors induced by the presence of CNT clusters, i.e. large porosity, lower effective conductivity of CNT clusters themselves and reduction of SPS cleaning effect. The CNT/Cu composites may be a promising thermal management material for heat sink applications. (C) 2009 Elsevier Ltd. All rights reserved.
引用
收藏
页码:298 / 304
页数:7
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