Reflow characteristics of Sn-Ag matrix in-situ composite solders

被引：35

作者：

Lee, JH ^{[1
]}

Park, DJ

Heo, JN

Lee, YH

Shin, DH

Kim, YS

机构：

[1] Hongik Univ, Dept Mat Sci & Met, Seoul 121791, South Korea

[2] Hanyang Univ, Dept Met & Mat Sci, Ansan 425791, South Korea

来源：

SCRIPTA MATERIALIA | 2000年 / 42卷 / 08期

关键词：

reflow soldering; interface reaction; solder; intermetallic; composites;

D O I：

10.1016/S1359-6462(99)00392-9

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

In this study, copper powders were added into a molten Sn-Ag solder to form in-situ Cu6Sn5 disperoids. The composite solder formed more uniform and thinner intermetallic layer at the solder/Cu contact pad interface. However, the disperoids coarsened very significantly during the reflow processing and their gravitational sedimentation was observed.

引用

页码：827 / 831

页数：5

共 18 条

[1] PROCESSING DISPERSION-STRENGTHENED SN-PB SOLDERS TO ACHIEVE MICROSTRUCTURAL REFINEMENT AND STABILITY [J].

BETRABET, HS ;

MCGEE, SM ;

MCKINLAY, JK .

SCRIPTA METALLURGICA ET MATERIALIA, 1991, 25 (10) :2323-2328

[2] Effect of the specimen size in predicting the mechanical properties of PbSn solder alloys [J].

Bonda, NR ;

Noyan, IC .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1996, 19 (02) :208-212

[3]

CHUNG DLD, 1992, Patent No. 5089356

[4]

DARREL RF, 1990, IEEE T COMPON HYBR, V13, P718

[5] METALLURGICAL CHANGES IN TIN LEAD PLATINGS DUE TO HEAT AGING [J].

GECKLE, RJ .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04) :691-697

[6]

IRING B, 1991, WELDING J OCT, P54

[7]

JIN S, 1994, J ELECT MAT, V23, P756

[8]

LEE SM, 1992, T ASME, V114, P118

[9]

Marshall Jeannie, 1997, SOLDERING SMT, P23

[10]

MASAHIDE H, 1990, IEEE T COMPON HYBR, V13, P736

← 1 2 →