Polymeric optoelectronic interconnects

被引:8
作者
Eldada, L [1 ]
机构
[1] Allied Signal Inc, Adv Technol, Morristown, NJ 07962 USA
来源
OPTOELECTRONIC INTERCONNECTS VII; PHOTONICS PACKAGING AND INTEGRATION II | 2000年 / 3952卷
关键词
polymers; interconnects; MCM; board; backplane;
D O I
10.1117/12.384397
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Electrical interconnects are reaching their fundamental limits and are becoming the speed bottleneck as processor speeds are increasing. A polymer-based interconnect technology was developed for affordable integrated optical circuits that address the optical signal processing needs in the telecom, datacom, and performance computing industries. We engineered organic polymers that can be readily made into single-mode, multimode, and micro-optical waveguide structures of controlled numerical apertures and geometries. These materials are formed from highly-crosslinked acrylate monomers with specific linkages that determine properties such as flexibility, robustness, optical loss, thermal stability, and humidity resistance. These monomers are intermiscible, providing for precise continuous adjustment of the refractive index over a wide range. In polymer form, they exhibit state-of-the-art loss values and exceptional environmental stability, enabling use in a variety of demanding applications. A wide range of rigid and flexible substrates can be used, including glass, quartz, silicon, glass-filled epoxy printed circuit board substrates, and flexible plastic films. The devices we describe include a variety of routing elements that can be used as part of a massively parallel photonic integrated circuit on the MCM, board, or backplane level.
引用
收藏
页码:190 / 201
页数:2
相关论文
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