Mechanism and thermal effect of delamination in light-emitting diode packages

被引：91

作者：

Hu, Jianzheng ^{[1
]}

Yang, Lianqiao ^{[1
]}

Shin, Moo Whan ^{[1
]}

机构：

[1] Myongji Univ, Dept Mat Sci & Engn, Yongin 449728, Kyunggi, South Korea

来源：

MICROELECTRONICS JOURNAL | 2007年 / 38卷 / 02期

关键词：

delamination; thermal resistance; thermo-mechanical stress; light-emitting diode;

D O I：

10.1016/j.mejo.2006.08.001

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This work reports on the mechanism of delamination in light-emitting diode (LED) packages and its effects on thermal characteristics of LEDs. The LED samples were subjected to moisture preconditioning followed by heat block testing. Transient thermal measurements were performed to investigate the thermal behavior of the delaminated LEDs. Increase of thermal resistance with the degree of delamination was observed from the transient measurement. The thermo-mechanical and hygro-mechanical stress distributions calculated from coupled-field FEA simulation agree well with the micrographical evidence. It was found that the thermo-mechanical stress plays more important role than the hygro-mechanical stress for the development of delamination in the LED packages. Moisture preconditioning for 3 and 6 h under 85 degrees C/85RH conditions was found to make little contribution to the delamination between the chip and lead frame. (c) 2006 Elsevier Ltd. All rights reserved.

引用

页码：157 / 163

页数：7

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