Localized electrochemical deposition of metals using micropipettes

被引：27

作者：

Müller, AD ^{[1
]}

Müller, F

Hietschold, M

机构：

[1] TU Chemnitz, Inst Phys, D-09107 Chemnitz, Germany

[2] Univ Essen Gesamthsch, Inst Inorgan Chem, D-45117 Essen, Germany

来源：

THIN SOLID FILMS | 2000年 / 366卷 / 1-2期

关键词：

scanning probe lithography; scanning ion-conductance microscopy; numerical simulations; electrochemical deposition;

D O I：

10.1016/S0040-6090(99)01117-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The localized electrochemical deposition of metals using a pulled micropipette as tip (similar as in scanning ion-conductance microscopy) is a new scanning probe lithography method, which is still under development. This paper investigates the dependence of the deposited structures on the deposition parameters (electrode potentials, tipsample distance). A 2D numerical simulation is used to visualize the potential distribution in the present geometry. A linear copper structure (300 mu m long and 100 mu m broad) has been produced in a first experiment. (C) 2000 Elsevier Science S.A. All rights reserved.

引用

页码：32 / 36

页数：5

共 20 条

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