Influence of substrate temperature on surface structure and electrical resistivity of the evaporated tin sulphide films

被引：40

作者：

Devika, M.

Reddy, N. Koteeswara ^{[1
]}

Ramesh, K.

Ganesan, V.

Gopal, E. S. R.

Reddy, K. T. Ramakrishna

机构：

[1] Indian Inst Sci, Dept Phys, Bangalore 560012, Karnataka, India

[2] Sri Venkateswara Univ, Dept Phys, Tirupati 517502, Andhra Pradesh, India

[3] CSR, Indore Ctr, Indore 452017, India

来源：

APPLIED SURFACE SCIENCE | 2006年 / 253卷 / 03期

关键词：

tin sulphide thin films; surface structure; electrical properties;

D O I：

10.1016/j.apsusc.2006.03.005

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Tin sulphide films have been deposited with an average thickness of 0.5 mu m at different substrate temperatures. The surface structure and electrical resistivity of the films were investigated at room temperature. The surface profiles were examined for crystallite size and roughness with respect to substrate temperature. The as-deposited films grown at low temperatures exhibited blurred hill shape grains with an average diameter and roughness of 85 and 14.5 nm, respectively. However, the films grown at higher temperatures showed nice square shape grains with an average size of 180 nm and roughness of 5.12 nm. More crystalline tin sulphide films showed a lower electrical resistivity of 29.9 Omega cm than other films. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：1673 / 1676

页数：4

共 5 条

[1] INVESTIGATIONS ON SNS [J].