Development of CMOS-compatible integrated silicon photonics devices

被引:109
作者
Izhaky, Nahum
Morse, Michael T.
Koehl, Sean [1 ]
Cohen, Oded
Rubin, Doron
Barkai, Assia
Sarid, Gadi
Cohen, Rami
Paniccia, Mario J.
机构
[1] Intel Corp, IL-91031 Jerusalem, Israel
[2] Intel Corp, Santa Clara, CA 95054 USA
关键词
complementary metal-oxide-semiconductor (CMOS); fabrication; integrated; manufacturing; optoelectronics; photonics; silicon;
D O I
10.1109/JSTQE.2006.884089
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 [电气工程]; 0809 [电子科学与技术];
摘要
This paper surveys technical challenges involved in designing and manufacturing integrated optoelectronic devices in a high-volume complementary metal-oxide-semiconductor (CMOS) microelectronic fabrication facility. The paper begins by introducing the motivations for building these devices in silicon. We discuss the advantages and challenges of both hybrid and monolithic strategies for optoelectronic integration. We then discuss the issues involved in building the devices in a standard CMOS facility, including specific technical examples. These include low-loss waveguides (WGs) for Raman lasers, fast silicon modulators, SiGe heterostructures for infrared photodetection, silicon-oxynitride (SiON) devices on silicon-on-insulator (SOI), silicon optical bench (SiOB) technology, and waveguide tapers. We conclude with a discussion and recommendations for future work in silicon photonics.
引用
收藏
页码:1688 / 1698
页数:11
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