Stacking fault reduction in silicon-on-insulator (SOI) islands produced by selective epitaxial growth (SEG) of silicon using a thermally nitrided SiO2 field insulator

被引:5
作者
Neudeck, GW
Merritt, KD
Denton, JP
机构
[1] Sch. of Elec. and Comp. Engineering, Purdue University, W. Lafayette
关键词
D O I
10.1016/S0167-9317(97)00087-7
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A method to fabricate silicon-on-insulator (SOI) device sized islands, using Epitaxial Lateral Overgrowth (ELO) from the Selective Epitaxial Growth (SEG) of Silicon, has approximate to 96.3% stacking fault-free SOI islands when SiO2 was used as the field insulator. When a nitrided thermal SiO2 was used approximate to 99% of the small islands were defect-free. Islands with rounded corners and nitrided oxide had stacking fault defects of less than 500/cm(2).
引用
收藏
页码:391 / 394
页数:4
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