Simulating process-induced gate oxide damage in circuits

Advanced processing techniques such as plasma etching and ion implantation can damage the gate oxides of MOS devices and thus pose a problem to circuit reliability. In this paper, we present a simulator which predicts oxide failure rates during and after processing and pinpoints strong charging current locations in the layout where changes can be made to improve circuit hot-carrier reliability, We present the models and experimental results used to develop the simulator and demonstrate the usefulness of this simulator.