Enhanced polymer ablation rates using high-repetition-rate ultraviolet lasers

被引：27

作者：

Illy, EK ^{[1
]}

Brown, DJW ^{[1
]}

Withford, MJ ^{[1
]}

Piper, JA ^{[1
]}

机构：

[1] Macquarie Univ, Div Informat & Commun Sci, Dept Phys, Ctr Lasers & Applicat, N Ryde, NSW 2109, Australia

来源：

IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS | 1999年 / 5卷 / 06期

基金：

澳大利亚研究理事会;

关键词：

laser ablation; laser machining; micromachining; pulsed lasers;

D O I：

10.1109/2944.814996

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Etch rates (mu m/pulse) for glycol-modified polyethylene terephthalate (PETG) under pulsed UV (255 nm) laser processing are measured as a function of pulse repetition frequency in the range 0.7-15 kHz. Materials removal rates (mu m/s) scale approximately linearly with pulse repetition frequency at a fluence of 0.59 J/cm(2), and there appears to be no attenuation of the ablating laser beam by the ejected material plume for pulse rates up to 15 kHz, The instantaneous etch rate for pulses in a sequence increases markedly (similar to 40%) for Long pulse sequences (>100 pulses) at high PRF (15 kHz), an effect which can be used to increase machining rates while operating at a moderate Laser fluence.

引用

页码：1543 / 1548

页数：6

共 14 条

[1]

BERGMANN HW, 1995, P COLL MECH OPT HOCH

[2] EXCIMER LASER ETCHING OF POLYIMIDE [J].