The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag

被引：36

作者：

Chen, KI ^{[1
]}

Lin, KL ^{[1
]}

机构：

[1] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2002年 / 31卷 / 08期

关键词：

lead-free solder; Sn-Zn; Sn-Zn-Ag; mechanical properties; DSC;

D O I：

10.1007/s11664-002-0196-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The microstructures and mechanical properties of Sn-8.55Zn-xAg-0.45 Al-0.5Ga (wt.%) lead-free solders were investigated. The x content of the solders investigated were 0.5-3.0 wt.%. The results indicate that Ag plays an important role not only in the structure but also in the mechanically properties. The mechanical properties and differential scanning calorimetry (DSC) behavior has been compared with that of 63Sn-37Pb solder. Small additions of Ag decreased the melting point of the Sn-8.55Zn-xAg-0.45Al-0.5Ga solders while maintaining the same strength and ductility as the 63Sn-37Pb solder.

引用

页码：861 / 867

页数：7

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