Analysis of ring and plug shear strengths for comparison of lead-free solders

被引：43

作者：

Foley, JC ^{[1
]}

Gickler, A

Leprevost, FH

Brown, D

机构：

[1] Ames Lab, Ames, IA 50011 USA

[2] Johnson Mfg Co, Princeton, IA 52768 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2000年 / 29卷 / 10期

关键词：

lead-free solders; shear strength; ring and plug joints;

D O I：

10.1007/s11664-000-0021-8

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The drive to replace the use of toxic lead metal and its alloys has spurred the development of many new lead-free solder alloys. Moreover, current leaded solders lack shear strength, resistance to creep and to thermal-mechanical fatigue. Solder that exhibits enhancements of these properties and retains solderability is crucial in applications where the solder joints are subjected to thermal cycling, severe vibrations, and temperatures of up to 125 degrees C. Modified ring and plug joints were made with 18 selected lead-free solders and three well characterized lead-containing solders. Analysis of the results provides a guide for the design of additional testing.

引用

页码：1258 / 1263

页数：6

共 5 条

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[2]

Humpston G., 1993, PRINCIPLES SOLDERING, P281

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JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY, 1993, 45 (07) :13-13

[4]

THWAITES CJ, 1976, REV SOUDERE LASTIJDS, V32, P196

[5] Properties of ternary Sn-Ag-Bi solder allays: Part II - Wettability and mechanical properties analyses [J].

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JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (10) :1138-1143

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