Integrating microelectromechanical systems with integrated circuits

被引：24

作者：

Bryzek, J ^{[1
]}

Flannery, A ^{[1
]}

Skurnik, D ^{[1
]}

机构：

[1] Microvision, Bothell, WA USA

来源：

IEEE INSTRUMENTATION & MEASUREMENT MAGAZINE | 2004年 / 7卷 / 02期

关键词：

D O I：

10.1109/MIM.2004.1304566

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Significant progress toward integrating MEMS with ICs technologies has been made over the last four decades. Many products have been introduced and the benefits of such integration have been demonstrated. One of the most attractive developments was the vertical MEMS-IC integration. The approach can be easily applied to capacitive sensors, such as pressure, acceleration, gyro, and vacuum sensors, as well as to a broad range of other products.

引用

页码：51 / 59

页数：9

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