Integrated micro heat sink for power multichip module

被引：36

作者：

Gillot, C ^{[1
]}

Schaeffer, C

Bricard, A

机构：

[1] Univ Grenoble 1, Lab Electrotech Grenoble, INPG, CNRS,UMR 5529,ENSIEG, F-38402 St Martin Dheres, France

[2] CEA Grenoble, DRN, DTP, CRT,GRETh1 Grp ADEME 1,CEA Rech Echangeurs, F-38054 Grenoble, France

来源：

IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS | 2000年 / 36卷 / 01期

关键词：

heat sink; microchannel; multichip module; power;

D O I：

10.1109/28.821819

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Today, more and more compact converters with high current are required. The thermal environment is a key point to meet these requirements: the heat sink must be integrated as closely as possible to heat sources, Liquid-cooled microchannel heat sinks are very efficient and well adapted to the cooling of power components, Thus, a high-performance micro heat sink was made and tested under a power multichip module. First, the principle of the microchannel heat sink and a three-dimensional approach are presented, Then, the prototype and the results are described. Composed of eight insulated gate bipolar transistor chips, the prototype has a current rating as high as 1200 A.

引用

页码：217 / 221

页数：5

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