Preparation and characterization of high-k praseodymium and lanthanoid oxide thin films prepared by pulsed laser deposition

被引:37
作者
Kitai, S [1 ]
Maida, O [1 ]
Kanashima, T [1 ]
Okuyama, M [1 ]
机构
[1] Osaka Univ, Grad Sch Engn Sci, Dept Phys Sci, Area Mat & Device Phys, Toyonaka, Osaka 5608531, Japan
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 2003年 / 42卷 / 01期
关键词
lanthanoid oxide; high-k gate insulator; pulsed laser deposition (PLD); shadow mask; PrOx;
D O I
10.1143/JJAP.42.247
中图分类号
O59 [应用物理学];
学科分类号
摘要
Several lanthanoid oxide thin films such as those of PrOx, Sm2O3, Tb4O7, Er2O3 and Yb2O3 have been prepared on Si(100) wafers by the pulsed laser deposition method (PLD). PrOx film shows thin SiO2-equivalent oxide thickness (EOT) and low leakage current simultaneously. On the other hand, SmOx thin film does not show good properties. It is revealed by XPS spectra of the PrOx film that the deposition in O-2 ambient of 0.2 Torr produces an interfacial SiO2 or silicate layer. The sample deposited in a high vacuum at RT has only an ultra-thin interfacial layer, but hysteresis in the C-V characteristic and leakage current are large. Other techniques have been carried out to reduce the energy of ablated particles in order to prevent the growth of an interfacial layer. In the deposition method using a shadow mask, very flat thin films were obtained. However, the deposition rate was very low, and growth of the interfacial layer could not be prevented. By enlarging the distance between substrate and target, the smallest EOT with the PrOx film in our study has been obtained by the reduction of the energy of ablated particles.
引用
收藏
页码:247 / 253
页数:7
相关论文
共 19 条
[1]  
CHIN A, 2000, MRS WORKSH NEW ORL, P13
[2]   Atomic beam deposition of lanthanum- and yttrium-based oxide thin films for gate dielectrics [J].
Guha, S ;
Cartier, E ;
Gribelyuk, MA ;
Bojarczuk, NA ;
Copel, MC .
APPLIED PHYSICS LETTERS, 2000, 77 (17) :2710-2712
[3]   Thermal stability of ultrathin ZrO2 films prepared by chemical vapor deposition on Si(100) [J].
Jeon, TS ;
White, JM ;
Kwong, DL .
APPLIED PHYSICS LETTERS, 2001, 78 (03) :368-370
[4]   Alternative dielectrics to silicon dioxide for memory and logic devices [J].
Kingon, AI ;
Maria, JP ;
Streiffer, SK .
NATURE, 2000, 406 (6799) :1032-1038
[5]  
KITAGAWA Y, 1999, SDM99174 IEICE
[6]   Characterization of Gd2O3 films deposited on Si(100) by electron-beam evaporation [J].
Landheer, D ;
Gupta, JA ;
Sproule, GI ;
McCaffrey, JP ;
Graham, MJ ;
Yang, KC ;
Lu, ZH ;
Lennard, WN .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2001, 148 (02) :G29-G35
[7]   Si-doped aluminates for high temperature metal-gate CMOS: Zr-Al-Si-O, a novel gate dielectric for low power applications [J].
Manchanda, L ;
Green, ML ;
van Dover, RB ;
Morris, MD ;
Kerber, A ;
Hu, Y ;
Han, JP ;
Silverman, PJ ;
Sorsch, TW ;
Weber, G ;
Donnelly, V ;
Pelhos, K ;
Klemens, F ;
Ciampa, NA ;
Kornblit, A ;
Kim, YO ;
Bower, JE ;
Barr, D ;
Ferry, E ;
Jacobson, D ;
Eng, J ;
Busch, B ;
Schulte, H .
INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, :23-26
[8]   Analysis of direct tunneling for thin SiO2 film [J].
Matsuo, N ;
Miura, T ;
Urakami, A ;
Miyoshi, T .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (7A) :3967-3971
[9]   High-k gate dielectrics with ultra-low leakage current based on praseodymium oxide [J].
Osten, HJ ;
Liu, JP ;
Gaworzewski, P ;
Bugiel, E ;
Zaumseil, P .
INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, :653-656
[10]  
Qi W.J., 1999, Tech. Dig. IEDM, P145