共 24 条
[1]
BADER S, 1995, ACTA METALL MATER, V43, P329, DOI 10.1016/0956-7151(94)00224-6
[3]
BOETTINGER WJ, 1993, MECH SOLDER ALLOY WE, P103
[4]
CHAD S, 1996, J ELECT MAT, V28, P1194
[6]
Pb-free solders for flip-chip interconnects
[J].
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY,
2001, 53 (06)
:28-+
[7]
Growth of η phase scallops and whiskers in liquid tin-solid copper reaction couples
[J].
JOM-JOURNAL OF THE MINERALS METALS & MATERIALS SOCIETY,
2001, 53 (06)
:33-38
[8]
Gradshteyn I S., 1993, Table of Integrals, Series and Products, V5th edition
[10]
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
[J].
PHYSICAL REVIEW B,
1996, 53 (23)
:16027-16034