Memory design using a one-transistor gain cell on SOI

被引:52
作者
Ohsawa, T [1 ]
Fujita, K
Higashi, T
Iwata, Y
Kajiyama, T
Asao, Y
Sunouchi, K
机构
[1] Toshiba Co Ltd, Memory LSI Res & Dev Ctr, Div Memory, Kamakura, Kanagawa 2478585, Japan
[2] Toshiba Microelect Corp, Memory Device Engn Dept, Kamakura, Kanagawa 2478585, Japan
[3] Toshiba Corp Semicond Co, Memory LSI Res & Dev Ctr, Yokohama, Kanagawa 2358522, Japan
关键词
capacitor-less DRAM; DRAM; embedded memory; floating body transistor cell; gain cell; nondestructive readout; silicon-on-insulator technology;
D O I
10.1109/JSSC.2002.802359
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A 512-kb memory has been developed featuring a one-transistor gain cell of size 7F(2) (F = 0. 18 mum) on SOI. The cell named the floating body transistor cell (FBC) has the ability to achieve a 4F(2) cell using self-aligned contact technologies and is proved to be scalable with respect to a cell signal. A basic operation was verified by device simulation and hardware measurement. An array driving method is disclosed which makes selective write possible. A cell signal sensing system consisting of a pair of reference cells written opposite data and comparing the combined current with the doubled cell current is shown to be robust against cell parameter variations in process and temperature. A random access time of 40 ns was simulated. Nondestructive readout and C-b/C-s free signal development drastically improve cell efficiency.
引用
收藏
页码:1510 / 1522
页数:13
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