A chip-scale packaging technology for 60-GHz wireless chipsets

被引：131

作者：

Pfeiffer, Ullrich R. ^{[1
]}

Grzyb, Janusz ^{[1
]}

Liu, Duixian ^{[1
]}

Gaucher, Brian ^{[1
]}

Beukema, Troy ^{[1
]}

Floyd, Brian A. ^{[1
]}

Reynolds, Scott K. ^{[1
]}

机构：

[1] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10598 USA

来源：

IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES | 2006年 / 54卷 / 08期

基金：

美国国家航空航天局;

关键词：

chip-scale packaging; low cost; millimeter wave; silicon germanium; wireless communication;

D O I：

10.1109/TMTT.2006.877832

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we present a cost-effective chip-scale packaging solution for a 60-GHz industrial-scientific-medical band receiver (Rx) and transmitter (Tx) chipset capable of gigabit-per-second wireless communications. Envisioned applications of the packaged chipset include 1-3-Gb/s directional links using amplitude shift-keying or phase shift-keying modulation and 500-Mb/s-1-Gb/s onmi-directional links using orthogonal frequency-division multiplexing modulation. This paper demonstrates the first fully package-integrated 60-GHz chipset including receive and transmit antennas in a cost-effective plastic package. A direct-chip-attach (DCA) and surface mountable land-grid-array (LGA) package technology is presented. The size of the DCA package is 7 x 11 mm(2) and the LGA package size is 6 x 13 mm(2). Optionally, the Tx and Rx chip can be packaged together with Tx and Rx antennas in a combined 13 x 13 mm(2) LGA transceiver package.

引用

页码：3387 / 3397

页数：11

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