High density packaging of X-band active array modules

被引：26

作者：

Hauhe, MS ^{[1
]}

Wooldridge, JJ ^{[1
]}

机构：

[1] TRW SPACE & TECHNOL GRP, RF PROD CTR, REDONDO BEACH, CA 90278 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1997年 / 20卷 / 03期

关键词：

active array; aluminum nitride; flip chip; folderless interconnects; gallium arsenide MMIC's; T/R modules;

D O I：

10.1109/96.618228

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A new high-density package design has been used to reduce the cost, weight, and size of X-band active array radars, The package used multilayer aluminum nitride (AIN) substrates, flipped monolithic microwave integrated circuit (MMIC) chips, coplanar waveguide transmission lines, and solderless fuzz button interconnects, This paper discusses the design tradeoffs, the package construction and assembly, and test results.

引用

页码：279 / 291

页数：13

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