Dewetting of molten Sn on Au/Cu/Cr thin-film metallization

被引：50

作者：

Liu, CY ^{[1
]}

Kim, HK ^{[1
]}

Tu, KN ^{[1
]}

Totta, PA ^{[1
]}

机构：

[1] IBM CORP,E FISHKILL FACIL,HOPEWELL JCT,NY 12533

来源：

APPLIED PHYSICS LETTERS | 1996年 / 69卷 / 26期

关键词：

D O I：

10.1063/1.117855

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

On Au/Cu/Cr thin film surface, a drop of molten Sn first spreads out to wet the surface, but it then pulls back to dewet. The latter is due to the spalling of Cu-Sn compounds and exposing the Cr surface to the molten Sn when all of the Cu film has been consumed by the wetting reaction. Dewetting is clearly undesirable for solder joints in electronic packaging, the phenomenon is presented here. (C) 1996 American Institute of Physics.

引用

页码：4014 / 4016

页数：3

共 9 条

[1] STUDIES OF SLT CHIP TERMINAL METALLURGY [J].