Design of a modular micropump based on anodic bonding

被引：37

作者：

Acero, MC ^{[1
]}

Plaza, JA ^{[1
]}

Esteve, J ^{[1
]}

Carmona, M ^{[1
]}

Marco, S ^{[1
]}

Samitier, J ^{[1
]}

机构：

[1] UNIV BARCELONA,DEPT FIS APLICADA & ELECT,E-08028 BARCELONA,SPAIN

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 1997年 / 7卷 / 03期

关键词：

D O I：

10.1088/0960-1317/7/3/026

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple and reliable technology for the fabrication of micromachined micropumps is presented. The assembling of different wafers to produce valves and cavities is usually the critical step regarding final yield. Our technology uses exclusively the well known anodic bonding technique for this purpose. The prospective performance of the devices has been evaluated by finite element methods and system level simulations.

引用

页码：179 / 182

页数：4