Anodic film growth on tantalum in dilute phosphoric acid solution at 20 and 85°C

被引:42
作者
Lu, Q
Mato, S
Skeldon, P
Thompson, GE
Masheder, D
Habazaki, H
Shimizu, K
机构
[1] Univ Manchester, Inst Sci & Technol, Corros & Protect Ctr, Manchester M60 1QD, Lancs, England
[2] AVX Ltd, Tantalum Div, Paignton TQ4 7ER, Devon, England
[3] Hokkaido Univ, Grad Engn Sch, Kita Ku, Sapporo, Hokkaido 0608628, Japan
[4] Keio Univ, Univ Chem Lab, Yokohama, Kanagawa 223, Japan
基金
英国工程与自然科学研究理事会;
关键词
tantalum; anodizing; anodic films; transmission electron microscopy; Rutherford backscattering spectroscopy;
D O I
10.1016/S0013-4686(02)00141-X
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The effects of current density and temperature on the anodic films formed on tantalum in dilute H3PO4 (0.06%wt) solution have been studied by transmission electron microscopy, using ultramicrotomed sections, and Rutherford backscattering spectroscopy. Two-layered films have been identified, comprising an inner relatively pure Ta2O5 layer, adjacent to the metal/film interface, and an outer layer containing incorporated pO(4)(3-) anions. The total amount and depth of incorporated phosphorus species increase with 4 increasing current density and decreasing temperature, in correspondence with the enhancement of the electric field. The formation conditions for the films include those relevant to the commercial anodising of tantalum for capacitors for which the extent of phosphorus incorporation is shown to be comparatively low. (C) 2002 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:2761 / 2767
页数:7
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