High-rate-deposition of Ni-Zn ferrite thin-films using ECR sputtering with conic target

被引：2

作者：

Yamamoto, S

Ogita, T

Kurisu, H

Matsuura, M

Shimosato, Y

Okada, S

机构：

[1] Yamaguchi Univ, Fac Engn, Ube, Yamaguchi 7558611, Japan

[2] Shimadzu Co Ltd, Kanagawa 2591304, Japan

来源：

PHYSICA STATUS SOLIDI A-APPLIED RESEARCH | 2004年 / 201卷 / 08期

关键词：

D O I：

10.1002/pssa.200304516

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Reactive sputtering utilizing a dense and active electron-cyclotron-resonance (ECR) microwave plasma enabled us low-temperature and high rate deposition of Ni-Zn spinel ferrite thin-films using a metal sputtering target. In this study, to achieve higher rate deposition, a conic target was introduced to a ECR sputtering apparatus we have developed, instead of platelet targets used in our previous work. The Ni-Zn ferrite thin-films with a reasonable saturation magnetization of about 290 emu/cc and low coercivity of about 11 Oe could be deposited at an increased deposition rate of 44 nm/min. Also, superior thickness uniformity was confirmed in the substrate area of 140 mm in diameter. (C) 2004 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

引用

页码：1781 / 1785

页数：5

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