Scratch drive actuator with mechanical links for self-assembly of three-dimensional MEMS

被引:140
作者
Akiyama, T [1 ]
Collard, D [1 ]
Fujita, H [1 ]
机构
[1] UNIV TOKYO, INST IND SCI, TOKYO 106, JAPAN
基金
日本学术振兴会;
关键词
electrostatic devices; fabrication; microactuators; microelectromechanical devices; position control;
D O I
10.1109/84.557525
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The self-assembling of three-dimensional (3-D) MEMS from polysilicon surface micromachined part is very attractive. To avoid risky external manipulation, the practical use of integrated actuator to perform the assembling task is required. To that goal, this paper presents detailed characteristics of the electrostatic surface micromachined scratch drive actuator (SDA). First, from numerous SDA test, it results that this actuator is able to produce a threshold force of 30 mu N, with a yield above 60%. With polysilicon devices consisting of SDA mechanically linked to buckling beam, a horizontal force of 63 mN have been demonstrated with +/-112 V pulse, and up to 100 mu N can be obtain with higher voltage. With buckling beams, displacements up to 150 mu m have been obtained in the vertical direction. The generation of vertical force of 10 mu N was confirmed with a 100 mu m displacement producing in 1 nJ work in the vertical direction. Finally, SDA proves to overcome the usual sticking of surface machined polysilicon by producing enough vertical force to completely release wide polysilicon plate (500 mu m x 50 mu m) without external manipulation. The above characteristic, both in terms of structure releasing and vertical/horizontai forces and displacements provide the SDA with the capability of self-assembling complex 3-D polysilicon part, opening new integration capabilities and new application held of MEMS.
引用
收藏
页码:10 / 17
页数:8
相关论文
共 18 条
[1]  
AKIYAMA T, 1995, MICRO ELECTRO MECHANICAL SYSTEMS - IEEE PROCEEDINGS, 1995, P310, DOI 10.1109/MEMSYS.1995.472603
[2]  
Akiyama T., 1993, Journal of Microelectromechanical Systems, V2, P106, DOI 10.1109/84.260254
[3]  
DANEMAN MJ, 1995, MICRO ELECTRO MECHANICAL SYSTEMS - IEEE PROCEEDINGS, 1995, P55, DOI 10.1109/MEMSYS.1995.472554
[4]  
DENG K, 1994, J MICROELECTROMECH S, V3, P127
[5]  
FUKUTA Y, IN PRESS I ELEC ENG
[6]  
Gere JM., 2006, Mechanics of Materials
[7]  
Hatamura Y., 1994, Proceedings IEEE Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems (Cat. No.94CH3404-1), P297, DOI 10.1109/MEMSYS.1994.555826
[8]   Surface-micromachined electrostatic-comb driven scanning micromirrors for barcode scanners [J].
Kiang, MH ;
Solgaard, O ;
Muller, RS ;
Lau, KY .
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, :192-197
[9]   Electrostatic microactuators with integrated gear linkages for mechanical power transmission [J].
Legtenberg, R ;
Berenschot, E ;
Elwenspoek, M ;
Fluitman, J .
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, :204-209
[10]   Standard CMOS piezoresistive sensor to quantify heart cell contractile forces [J].
Lin, G ;
Pister, KSJ ;
Roos, KP .
NINTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS, IEEE PROCEEDINGS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND SYSTEMS, 1996, :150-155