Thermal cycling reliability of lead-free chip resistor solder joints

被引：20

作者：

Suhling, JC ^{[1
]}

Gale, HS

Johnson, RW

Islam, MN

Shete, T

Lall, P

Bozack, MJ

Evans, JL

Seto, P

Gupta, T

Thompson, JR

机构：

[1] Auburn Univ, Ctr Adv Vehicle Elect, Auburn, AL 36849 USA

[2] DaimlerChrysler Huntsville Elect, Huntsville, AL USA

来源：

SOLDERING & SURFACE MOUNT TECHNOLOGY | 2004年 / 16卷 / 02期

关键词：

soldering; joining processes; product reliability;

D O I：

10.1108/09540910410537354

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the thermal cycling reliability of several 2512 chip resistor lead-free solder joint configurations has been investigated. In an initial study, a comparison has been made between the solder joint reliabilities obtained with components fabricated with both tin-lead and pure tin solder terminations. In the main portion of the reliability testing, two temperature ranges (-40-125degreesC and -40-150degreesC) and five different solder alloys have been examined. The investigated solders include the normal eutectic Sn-Ag-Cu (SAC) alloy recommended by earlier studies (95.5Sn-3.8Ag-0.7Cu), and three variations of the lead-free ternary SAC alloy that include small quaternary additions of bismuth and indium to enhance fatigue resistance.

引用

页码：77 / 87

页数：11

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