The main advantages of microprinting of sensing materials on micro-hotplates are discussed in terms of the extra thermal mass in the microsystem. FEM simulations and dynamic measurements allow a description of the thermal distribution in the active layer, thermal transient response, power consumption and mechanical behavior. These results suggest some technical limitations in the use of the present technology in order to keep reliable sensors. Finally, the compatibility of the microprinting technology with the implantation of different metal oxides is investigated. Whereas, materials such as TiO2, or WO3 seem to be indicated for microdroping, other such ZrO2, or Bi2O5 exhibit some problems when deposited. (C) 2002 Elsevier Science B.V. All rights reserved.