On the deposition rate in a high power pulsed magnetron sputtering discharge

被引：151

作者：

Alami, J. ^{[1
]}

Sarakinos, K.

Mark, G.

Wuttig, M.

机构：

[1] Univ Aachen, Rhein Westfal TH Aachen, Inst Phys, D-52056 Aachen, Germany

[2] MELEC GmbH, D-77833 Ottersweier, Germany

来源：

APPLIED PHYSICS LETTERS | 2006年 / 89卷 / 15期

关键词：

D O I：

10.1063/1.2362575

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The effect of the high pulse current and the duty cycle on the deposition rate in high power pulsed magnetron sputtering (HPPMS) is investigated. Using a Cr target and the same average target current, deposition rates are compared to dc magnetron sputtering (dcMS) rates. It is found that for a peak target current density I-Tpd of up to 570 mA cm(-2), HPPMS and dcMS deposition rates are equal. For I-Tpd > 570 mA cm(-2), optical emission spectroscopy shows a pronounced increase of the Cr+/Cr-0 signal ratio. In addition, a loss of deposition rate, which is attributed to self-sputtering, is observed. (c) 2006 American Institute of Physics.

引用

页数：3

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