Transient enhanced diffusion of implanted boron in 4H-silicon carbide

被引:53
作者
Janson, MS
Linnarsson, MK
Hallén, A
Svensson, BG
Nordell, N
Bleichner, H
机构
[1] Royal Inst Technol, Dept Elect, S-16440 Kista, Sweden
[2] IMC, S-16440 Kista, Sweden
[3] ABB Corp Res, S-16440 Kista, Sweden
关键词
D O I
10.1063/1.126055
中图分类号
O59 [应用物理学];
学科分类号
摘要
Experimental evidence is given for transient enhanced diffusion of boron (B) in ion-implanted silicon carbide (SiC). The implanted B is diffusing several mu m into the samples when annealed at 1600 and 1700 degrees C for 10 min, but the in-diffused tails remain unaffected when the annealing times are increased to 30 min at the same temperatures. A lower limit of the effective B diffusivity at 1600 degrees C is determined to 7x10(-12) cm(2)/s, which is 160 times larger than the equilibrium B diffusivity given in the literature. (C) 2000 American Institute of Physics. [S0003-6951(00)03111-9].
引用
收藏
页码:1434 / 1436
页数:3
相关论文
共 24 条
[21]   Physical mechanisms of transient enhanced dopant diffusion in ion-implanted silicon [J].
Stolk, PA ;
Gossmann, HJ ;
Eaglesham, DJ ;
Jacobson, DC ;
Rafferty, CS ;
Gilmer, GH ;
Jaraiz, M ;
Poate, JM ;
Luftman, HS ;
Haynes, TE .
JOURNAL OF APPLIED PHYSICS, 1997, 81 (09) :6031-6050
[22]  
Troffer T, 1997, PHYS STATUS SOLIDI A, V162, P277, DOI 10.1002/1521-396X(199707)162:1<277::AID-PSSA277>3.0.CO
[23]  
2-C
[24]  
VODAKOV YA, 1977, SOV PHYS SEMICOND+, V11, P214