Resists for next generation lithography

被引:65
作者
Brainard, RL
Barclay, GG
Anderson, EH
Ocola, LE
机构
[1] Shipley Co Inc, Marlborough, MA 01752 USA
[2] Univ Calif Berkeley, Lawrence Berkeley Natl Lab, Berkeley, CA 94720 USA
[3] Agere Syst, Murray Hill, NJ 07974 USA
关键词
NGL; LER; EUV; X-ray; EPL; IPL; resolution; resists; photoresists;
D O I
10.1016/S0167-9317(02)00564-6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Four next generation lithographic options (EUV, X-ray, EPL, IPL) are compared against four current optical technologies (i-line, DUV, 193 nm, 157 nm) for resolution capabilities based on wavelength. Studies are also made comparing absorption characteristics and their role in polymer design for NGL Resists. EUV, X-ray, EPL, and IPL all have important, but distinct, requirements for resist sensitivity. EPL requires resists that are 30 times more sensitive than UV6(TM). Although the needs are less extreme, EUV and X-ray also require sensitivities that are beyond most conventional resists. IPL does not appear to have sensitivity issues. Quite often, increases in resist sensitivity can only be achieved at the cost of other important resist properties, such as resolution, environmental stability and line edge roughness. This challenge must be met in order to properly design resists for NGL. (C) 2002 Published by Elsevier Science B.V.
引用
收藏
页码:707 / 715
页数:9
相关论文
共 11 条
[1]   Comparison of the lithographic properties of positive resists upon exposure to deep- and extreme-ultraviolet radiation [J].
Brainard, RL ;
Henderson, C ;
Cobb, J ;
Rao, V ;
Mackevich, JF ;
Okoroanyanwu, U ;
Gunn, S ;
Chambers, J ;
Connolly, S .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (06) :3384-3389
[2]   Characterization of Shipley's positive deep UV experimental resists: Deblocking studies [J].
Cameron, JF ;
Orellana, AJ ;
Rajaratnam, MM ;
Sinta, RF .
ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XIII, 1996, 2724 :261-272
[3]  
*ITRS, ITRS 2000 UPDATE LIT
[4]  
KAESMAIER R, 2001, 2001 NGL WORKSH
[5]  
NAMATSU H, 2001, 2001 NGL WORKSH EBDW
[6]  
OCOLA L, 2001, XEL WORKSH 1995 EPL
[7]  
Ocola L. E., 2001, Journal of Photopolymer Science and Technology, V14, P547, DOI 10.2494/photopolymer.14.547
[8]  
OCONNELL D, 2000, EUV WORKSH
[9]  
Okamoto K, 2000, SOLID STATE TECHNOL, V43, P118
[10]   DEVELOPMENT OF POSITIVE ELECTRON-BEAM RESIST FOR 50 KV ELECTRON-BEAM DIRECT-WRITING LITHOGRAPHY [J].
SAKAMIZU, T ;
YAMAGUCHI, H ;
SHIRAISHI, H ;
MURAI, F ;
UENO, T .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1993, 11 (06) :2812-2817