Soft mold and gasbag pressure mechanism for patterning submicron patterns onto a large concave substrate

被引：21

作者：

Cheng, Fang-Sung

Yang, Sen-Yeu ^{[1
]}

Nian, Shih-Chih

Wang, Lon A.

机构：

[1] Natl Taiwan Univ, Grace Lab Polymer Proc, Dept Mech Engn, Taipei 106, Taiwan

[2] Dahan Inst Technol, Dept Mech Engn, Taipei 106, Taiwan

[3] Natl Taiwan Univ, Dept Elect Engn, Taipei 106, Taiwan

[4] Natl Taiwan Univ, Grad Inst Electopt Engn, Taipei 106, Taiwan

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2006年 / 24卷 / 04期

关键词：

D O I：

10.1116/1.2209991

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

A gasbag pressure (GBP) mechanism has been developed for patterning submicron patterns onto large concave substrate. The GBP mechanism consists of a pressure gasbag and a vacuum chamber system. It provides gradual contact, uniform pressure, and intact contact for imprinting patterns in the soft mold onto a concave substrate. The patterns on the soft mold can be successfully replicated over an entire photoresist-coated concave substrate. The accuracy of replication has been experimentally evaluated. (c) 2006 American Vacuum Society.

引用

收藏

页码：1724 / 1727

页数：4

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