Deposition of copper films by an alternate supply of CuCl and Zn

被引:56
作者
Juppo, M [1 ]
Ritala, M [1 ]
Leskela, M [1 ]
机构
[1] UNIV HELSINKI,DEPT CHEM,FIN-00014 HELSINKI,FINLAND
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1997年 / 15卷 / 04期
关键词
D O I
10.1116/1.580743
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Deposition of copper thin films by an alternate supply of CuCl and Zn was examined. Due to a reversible dissolution of Zn into the Cu film, no self-limiting growth characteristic for the atomic layer epitaxy method could be achieved. The resulting films contained about 3 at. % zinc while chlorine residue contents were below 0.5 at. %. The films were polycrystalline consisting of rather coarse grains. (C) 1997 American Vacuum Society.
引用
收藏
页码:2330 / 2333
页数:4
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