Tin-silver-copper eutectic temperature and composition

被引：151

作者：

Loomans, ME ^{[1
]}

Fine, ME ^{[1
]}

机构：

[1] Northwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Mat Sci & Engn, Evanston, IL 60208 USA

来源：

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 2000年 / 31卷 / 04期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1007/s11661-000-0111-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A careful investigation of the Sn-Ag-Cu phase diagram near the ternary eutectic composition was undertaken using annealed alloys and differential scanning calorimetry to settle some uncertainties in the eutectic composition. The eutectic composition was found to be 3.5 wt pct Ag, 0.9 wt pct Cu, and the balance Sn. The published eutectic temperature, 217 degrees C, was confirmed. A value of 217.2 degrees C was obtained in the present research.

引用

页码：1155 / 1162

页数：8

共 6 条

[1]

ANDERSON IE, 1997, REL SOLD SOLD JOINTS

[2]

KURZ W, 1992, FUNDAMENTALS SOLIDIF, P110

[3]

LOOMANS ME, 1997, UNPUB

[4] NEW PB-FREE SOLDER ALLOY WITH SUPERIOR MECHANICAL-PROPERTIES [J].

MCCORMACK, M ;

JIN, S ;

KAMMLOTT, GW ;

CHEN, HS .

APPLIED PHYSICS LETTERS, 1993, 63 (01) :15-17

[5] A VIABLE TIN-LEAD SOLDER SUBSTITUTE - SN-AG-CU [J].

MILLER, CM ;

ANDERSON, IE ;

SMITH, JF .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (07) :595-601

[6]

Pearson W.B., 1967, HDB LATTICE SPACINGS, V2

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