A VIABLE TIN-LEAD SOLDER SUBSTITUTE - SN-AG-CU

被引：243

作者：

MILLER, CM

ANDERSON, IE

SMITH, JF

机构：

[1] Ames Laboratory, Iowa State University, Ames, 50011, IA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1994年 / 23卷 / 07期

关键词：

DIFFERENTIAL THERMAL ANALYSIS; LEAD-FREE SOLDER; SCANNING ELECTRON MICROSCOPY; TIN-SILVER-COPPER EUTECTIC; WAVELENGTH DISPERSIVE SPECTROMETRY; X-RAY DIFFRACTION;

D O I：

10.1007/BF02653344

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Rising concern over the use of lead in industry provides a driving force for the development of improved lead-free industrial materials. Therefore, a new lead-free base solder alloy Sn-4.7Ag1.7Cu (wt.%) has been developed upon which a family of lead-free solders can be based. This solder alloy exhibits a ternary eutectic reaction at 216.8 +/- 1-degrees-C (L --> eta + theta + beta-Sn; eta = Cu6Sn5, theta = Ag3Sn). Preliminary tests of solderability demonstrate intermetallic phase formation on model solder joint interfaces and good wettability in a fluxed condition suggest technological viability and motivates much more extensive study of this solder alloy.

引用

页码：595 / 601

页数：7

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