Laser propulsion of microelectronic components: releasing mechanism investigation

被引：9

作者：

Karlitskaya, Natallia S. ^{[1
]}

Meijer, Johan ^{[1
]}

de Lange, Dirk F. ^{[2
]}

Kettelarij, Henk ^{[3
]}

机构：

[1] Univ Twente, Dept Mech Engn, POB 217, NL-7500 AE Enschede, Netherlands

[2] Univ Twente, CTW WA, Netherlands Inst Met Res, NL-7500 AE Enschede, Netherlands

[3] Philips Appl Technol, NL-5656 AE Eindhoven, Netherlands

来源：

HIGH-POWER LASER ABLATION VI, PTS 1 AND 2 | 2006年 / 6261卷

关键词：

laser propulsion; silicon processing; releasing; transferring;

D O I：

10.1117/12.673815

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

Laser propulsion has gained increasing attention in the recent years. Ultra-high average power laser systems have emerged and found applications in launching satellites to the space. The impulse generated by ablation can also be used to move small parts. This article describes laser-induced releasing of microelectronic components from its carrier material. The releasing mechanisms can be divided in: ablative and thermal releasing, depending from polymers, which are used as the component's carrier material and whether low or high laser fluence is used. The directional variation and speed variations under different operating conditions were studied and presented. Application of this technique as a fast microelectronics components assembly method is demonstrated.

引用

页数：10