Influence of copper on the morphology of porous anodic alumina

被引：70

作者：

Garcia-Vergara, S. J. ^{[1
]}

El Khazmi, K. ^{[1
]}

Skeldon, P. ^{[1
]}

Thompson, G. E. ^{[1
]}

机构：

[1] Univ Manchester, Sch Mat, Ctr Corros & Protect, Manchester M60 1QD, Lancs, England

来源：

CORROSION SCIENCE | 2006年 / 48卷 / 10期

基金：

英国工程与自然科学研究理事会;

关键词：

aluminium; copper; anodizing; anodic films;

D O I：

10.1016/j.corsci.2005.10.017

中图分类号：

T [工业技术];

学科分类号：

08 [工学];

摘要：

Sputtering-deposited Al-Cu alloy layers and an Al-Cu/Al bi-layer are used to investigate the influences of copper on the morphology of porous anodic alumina films formed galvanostatically in either sulphuric or phosphoric acid electrolyte. The results reveal development of an irregular morphology of pores during anodizing of the alloy layers, contrasting with the linear porosity of films formed on aluminium. Further, the rates of film growth and alloy consumption are relatively low, since oxygen is generated following enrichment of copper in the alloy and incorporation of copper species into the anodic film. The linear morphology is re-established following depletion of the copper in the bi-layer and at the same time, film growth accelerates as oxygen evolution diminishes. The irregular pore morphology is considered to arise from stress-driven pore development influenced by effects of oxygen bubbles within the anodic alumina. (c) 2005 Elsevier Ltd. All rights reserved.

引用

页码：2937 / 2946

页数：10

共 16 条

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STUDY BY NUCLEAR MICROANALYSIS AND O-18 TRACER TECHNIQUES OF OXYGEN-TRANSPORT PROCESSES AND GROWTH LAWS FOR POROUS ANODIC OXIDE LAYERS ON ALUMINUM [J].