Thermal properties of carbon nanotube array used for integrated circuit cooling

被引:79
作者
Xu, Yuan
Zhang, Yi
Suhir, Ephraim
Wang, Xinwei
机构
[1] Nanoconduct Inc, Sunnyvale, CA 94089 USA
[2] Univ Nebraska, Dept Mech Engn, Lincoln, NE 68588 USA
基金
美国国家科学基金会;
关键词
D O I
10.1063/1.2337254
中图分类号
O59 [应用物理学];
学科分类号
摘要
Carbon nanotubes (CNTs), owing to their exceptionally high thermal conductivity, have a potential to be employed in micro- and optoelectronic devices for integrated circuit (IC) cooling. In this study we describe a photothermal metrology intended to evaluate the thermal conductivity of a vertically aligned CNT array (VCNTA) grown on a silicon (Si) substrate. Plasma-enhanced chemical vapor deposition, with nickel (Ni) as a catalyst, was used to grow CNT. The experimentally evaluated thermal conductivity of the VCNTA and the thermal contact resistance at the interface between the VCNTA and the "hot" surface was found to be in a satisfactory agreement with theoretical predictions. The measured effective thermal resistance is measured to be 0.12 similar to 0.16 cm(2)center dot K/W. This resistance was compared to the measured resistance of commercially available thermal grease. Based on this comparison, we conclude that, although the thermal resistance of CNTs might not be as low as it might be desirable, there exists a definite incentive for using VCNTA of the type in question for IC cooling. (c) 2006 American Institute of Physics.
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页数:5
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