Remotely coupled surface plasmons in a metal/insulator/Si structure perforated with periodic square hole arrays

被引：9

作者：

Chuang, Tzu-Hung ^{[1
]}

Tsai, Ming-Wei ^{[1
]}

Chang, Yi-Tsung ^{[1
]}

Lee, Si-Chen ^{[1
]}

机构：

[1] Natl Taiwan Univ, Grad Inst Elect Engn, Dept Elect Engn, Taipei 106, Taiwan

来源：

APPLIED PHYSICS LETTERS | 2006年 / 89卷 / 03期

关键词：

D O I：

10.1063/1.2234290

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The zero-order transmission of radiation through a metal/dielectric structure perforated with square hole arrays is strongly enhanced when incident light resonates with surface plasmons (SPs). Surprisingly, when a metal/dielectric double layer, such as Ag/SiO2, is fabricated on a silicon substrate, the Ag/Si SP mode by coupling Ag and Si across the intermediate dielectric film has been found. It is named the remotely coupled surface plasmon. The transmission intensity is investigated as a function of the intermediate SiO2 thickness. The coupling lengths between Ag and Si in order to form the Ag/Si SP mode are determined as well, and they turn out to be 500 and 130 nm for couplings through air and a SiO2 layer, respectively. (c) 2006 American Institute of Physics.

引用

页数：3

共 14 条

[11] Enhanced transmission of THz radiation through subwavelength holes [J].

Rivas, JG ;

Schotsch, C ;

Bolivar, PH ;

Kurz, H .

PHYSICAL REVIEW B, 2003, 68 (20)

[12] Extraordinary infrared transmission of Cu-coated arrays with subwavelength apertures: Hole size and the transition from surface plasmon to waveguide transmission [J].

Williams, SM ;

Stafford, AD ;

Rogers, TM ;

Bishop, SR ;

Coe, JV .

APPLIED PHYSICS LETTERS, 2004, 85 (09) :1472-1474

[13] Accessing surface plasmons with Ni microarrays for enhanced IR absorption by monolayers [J].

Williams, SM ;

Stafford, AD ;

Rodriguez, KR ;

Rogers, TM ;

Coe, JV .

JOURNAL OF PHYSICAL CHEMISTRY B, 2003, 107 (43) :11871-11879

[14] Middle-infrared transmission enhancement through periodically perforated metal films [J].

Ye, YH ;

Zhang, JY .

APPLIED PHYSICS LETTERS, 2004, 84 (16) :2977-2979

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