Elimination of post-release adhesion in microstructures using conformal fluorocarbon coatings

被引:52
作者
Man, PF
Gogoi, BP
Mastrangelo, CH
机构
[1] Ctr. for Intgd. Sensors and Circuits, Dept. of Elec. Eng. and Comp. Sci., University of Michigan, Ann Arbor
[2] University of Michigan, Ann Arbor, MI
[3] Solid-State Electronics Laboratory, University of Michigan
[4] University of California, Berkeley, CA
[5] Scientific Research Laboratory, Ford Motor Co., Dearborn, MI
[6] Elec. Eng. and Comp. Sci. Department, University of Michigan, Ann Arbor, MI
基金
美国国家科学基金会;
关键词
adhesion; fluorocarbon coatings; microstructures; plasma polymerization; stiction;
D O I
10.1109/84.557527
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The adhesion of polysilicon microstructures to their substrates is eliminated using a relatively conformal hydrophobic fluorocarbon (FC) coating grown in a field-free zone of a plasma reactor. Experiments show that the FC film deposition on top of the microstructure and on the underside was approximately 2:1. The FC coating is able to cover the entire underside of a 200 x 200 mu m(2) plate, with a 20% deposition nonuniformity. The coating exhibits a contact angle of 110 degrees and is able to prevent adhesion of cantilever beams and doubly supported beams to their substrates even after direct immersion in DI water. The durability of the coating was tested using an accelerated aging method, predicting a lifetime of greater than ten years at 150 degrees C. Periodic wear tests indicate that the coating remains hydrophobic even after 10(7) contact cycles.
引用
收藏
页码:25 / 34
页数:10
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