Increased strain rate sensitivity due to stress-coupled grain growth in nanocrystalline Al

被引：129

作者：

Gianola, D. S. ^{[1
]}

Warner, D. H. ^{[1
]}

Molinari, J. F. ^{[1
]}

Hemker, K. J. ^{[1
]}

机构：

[1] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA

来源：

SCRIPTA MATERIALIA | 2006年 / 55卷 / 07期

关键词：

nanocrystalline materials; strain rate sensitivity; grain boundary migration; molecular dynamics; thin films; ACTIVATION VOLUME; METALS; DEFORMATION; TEMPERATURE; BOUNDARIES; SIZE;

D O I：

10.1016/j.scriptamat.2006.06.002

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

A combined experimental/simulation approach has been used to characterize the underlying deformation mechanisms associated with stress-assisted grain growth in nanocrystalline Al. Strain rate sensitivity experiments on freestanding submicron thin films undergoing stress-assisted grain boundary migration have uncovered rate sensitivities up to two orders of magnitude larger than previously reported for microcrystalline Al. Molecular dynamics simulations have been used to illustrate that these high strain rate sensitivities coincide with those associated with grain boundary processes such as migration, sliding, and dislocation nucleation. (c) 2006 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

引用

页码：649 / 652

页数：4

共 30 条

[1] Mechanistic models for the activation volume and rate sensitivity in metals with nanocrystalline grains and nano-scale twins [J].

Asaro, RJ ;

Suresh, S .

ACTA MATERIALIA, 2005, 53 (12) :3369-3382

[2] A unified approach to motion of grain boundaries, relative tangential translation along grain boundaries, and grain rotation [J].

Cahn, JW ;

Taylor, JE .

ACTA MATERIALIA, 2004, 52 (16) :4887-4898

[3] Hardness and strain rate sensitivity of nanocrystalline Cu [J].

Chen, J ;

Lu, L ;

Lu, K .

SCRIPTA MATERIALIA, 2006, 54 (11) :1913-1918

[4] Tensile properties of in situ consolidated nanocrystalline Cu [J].

Cheng, S ;

Ma, E ;

Wang, YM ;

Kecskes, LJ ;

Youssef, KM ;

Koch, CC ;

Trociewitz, UP ;

Han, K .

ACTA MATERIALIA, 2005, 53 (05) :1521-1533

[5] Nanocrystalline electrodeposited Ni: microstructure and tensile properties [J].

Dalla Torre, F ;

Van Swygenhoven, H ;

Victoria, M .

ACTA MATERIALIA, 2002, 50 (15) :3957-3970

[6] Stress-assisted discontinuous grain growth and its effect on the deformation behavior of nanocrystalline aluminum thin films [J].

Gianola, D. S. ;

Van Petegem, S. ;

Legros, M. ;

Brandstetter, S. ;

Van Swygenhoven, H. ;

Hemker, K. J. .

ACTA MATERIALIA, 2006, 54 (08) :2253-2263

[7]

Gianola D.S., 2004, TMS Letters, V1, P149

[8] The effect of triple-junction drag on grain growth [J].

Gottstein, G ;

King, AH ;

Shvindlerman, LS .

ACTA MATERIALIA, 2000, 48 (02) :397-403

[9] SECONDARY RECRYSTALLIZATION EFFECTS IN NANOSTRUCTURED ELEMENTAL METALS [J].

GUNTHER, B ;

KUMPMANN, A ;

KUNZE, HD .

SCRIPTA METALLURGICA ET MATERIALIA, 1992, 27 (07) :833-838

[10] Grain boundary migration as rotational deformation mode in nanocrystalline materials [J].

Gutkin, MY ;

Ovid'ko, IA .

APPLIED PHYSICS LETTERS, 2005, 87 (25) :1-3

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