Thermomigration in Pb-Sn solder joints under joule heating during electric current stressing

被引：224

作者：

Ye, H ^{[1
]}

Basaran, C ^{[1
]}

Hopkins, D ^{[1
]}

机构：

[1] SUNY Buffalo, Elect Packaging Lab, Buffalo, NY 14260 USA

来源：

APPLIED PHYSICS LETTERS | 2003年 / 82卷 / 07期

关键词：

Thermomigration;

D O I：

10.1063/1.1554775

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Electromigration of solder joint under high dc current density is known as a reliability concern for the future high-density flip chip packaging and power packaging. Biased mass diffusion within solder joint from cathode to anode under high dc current density is observed in these experiments. In this letter, the experiments on flip chip solder joints under dc current stressing are conducted and thermomigration due to the thermal gradient in the solder joint caused by joule heating is reported. A three-dimensional coupled electric thermal finite-element (FE) simulation of a realistic flip chip module shows the existence of thermal gradient in the solder joint which is high enough to trigger thermomigration. (C) 2003 American Institute of Physics.

引用

页码：1045 / 1047

页数：3

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