Reactive ion etching of InP/InAlGaAs/InGaAs heterostructures

被引:5
作者
Lemm, C [1 ]
Kollakowski, S [1 ]
Bimberg, D [1 ]
Janiak, K [1 ]
机构
[1] HEINRICH HERTZ INST NACHRICHTENTECH BERLIN GMBH,D-10587 BERLIN,GERMANY
关键词
D O I
10.1149/1.1837936
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
InAlGaAs in combination with InP, InGaAs, and InAlAs is an attractive material for long wavelength applications. Reactive ion etching of InP/InAlGaAs/InGaAs heterostructures using CH4/H-2/Ar plasma is systematically investigated and optimization is obtained. The etching process is investigated as a function of radio-frequency power density and total pressure and its results are characterized in terms of etch rate, surface-roughness, and etch profile. Etch conditions for the smooth and reproducable etching of Al-containing heterostructures are reported. The quality of the results achieved is reflected by excellent quality epitaxial InP overgrowth.
引用
收藏
页码:L255 / L257
页数:3
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