Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization

被引：108

作者：

Liu, CY ^{[1
]}

Tu, KN

Sheng, TT

Tung, CH

Frear, DR

Elenius, P

机构：

[1] Univ Calif Los Angeles, Dept Mat Sci & Engn, Los Angeles, CA 90005 USA

[2] Inst Microelect, Singapore 117685, Singapore

[3] SEMATECH, Austin, TX 78741 USA

[4] Flip Clip Technol, Phoenix, AZ 85034 USA

来源：

JOURNAL OF APPLIED PHYSICS | 2000年 / 87卷 / 02期

关键词：

D O I：

10.1063/1.371967

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The wetting reaction between molten eutectic SnPb solder and a sputtered trilayer Cu/Ni(V)/Al thin film metallization was studied using cross-sectional transmission electron microscopy and scanning electron microscopy. Reaction temperatures were from 200 to 240 degrees C and reaction times ranged from 1 to 40 min. The initial reaction products were Cu6Sn5 and Cu3Sn. The latter transforms to the former after an annealing greater than 1 min at 220 degrees C. The Cu6Sn5 grains adhere well to the Ni(V) surface and no spalling of them was observed, even after 40 min at 220 degrees C. This surprising result indicates that the Cu/Ni(V)/Al or Cu6Sn5/Ni(V)/Al is a stable thin film metallization for low temperature eutectic SnPb solder direct chip attachment to organic substrates. Additionally, Kirkendall voids accompanied Cu3Sn formation, yet the voids disappear when the Cu3Sn transforms to Cu6Sn5. (C) 2000 American Institute of Physics. [S0021-8979(99)02423-8].

引用

页码：750 / 754

页数：5

共 15 条

[1]

Aschenbrenner R., 1997, IEEE Transactions on Components, Packaging & Manufacturing Technology, Part C (Manufacturing), V20, P95, DOI 10.1109/3476.622879

[2] STUDIES OF SLT CHIP TERMINAL METALLURGY [J].

BERRY, BS ;

AMES, I .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :286-&

[3]

Elenius P, 1999, SOLID STATE TECHNOL, V42, P45

[4]

Hansen M., 1985, CONSTITUTION BINARY

[5] Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology [J].

Jang, JW ;

Kim, PG ;

Tu, KN ;

Frear, DR ;

Thompson, P .

JOURNAL OF APPLIED PHYSICS, 1999, 85 (12) :8456-8463

[6] Ripening-assisted asymmetric spalling of Cu-Sn compound spheroids in solder joints on Si wafers [J].

Kim, HK ;

Tu, KN ;

Totta, PA .

APPLIED PHYSICS LETTERS, 1996, 68 (16) :2204-2206

[7]

Lau J.H., 1996, FLIP CHIP TECHNOLOGI

[8] Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films [J].

Liu, AA ;

Kim, HK ;

Tu, KN ;

Totta, PA .

JOURNAL OF APPLIED PHYSICS, 1996, 80 (05) :2774-2780

[9] Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition [J].

Liu, CY ;

Tu, KN .

JOURNAL OF MATERIALS RESEARCH, 1998, 13 (01) :37-44

[10]

Moffatt W.G., 1981, HDB BINARY PHASE DIA

← 1 2 →