Phase equilibria of the Sn-Ag-Ni ternary system and interfacial reactions at the Sn-Ag/Ni joints

被引:53
作者
Hsu, HF [1 ]
Chen, SW [1 ]
机构
[1] Natl Tsing Hua Univ, Dept Chem Engn, Hsinchu 300, Taiwan
关键词
phase equilibria; interfacial reactions; Sn-Ag; Ni;
D O I
10.1016/j.actamat.2004.02.002
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
There are no previous phase equilibria studies of the Sn-Ag-Ni ternary system, even though the phase equilibria information is important for the electronic industry. The isothermal section of the Sn-Ag-Ni ternary system at 240 degreesC has been determined in this study both by experimental examination and thermodynamic calculation. Experimental results show no existence of ternary compounds in the Sn-Ag-Ni system, and all the constituent binary compounds have very limited solubilities of the ternary elements. The binary Ni3Sn2 phase is very stable and is in equilibrium with most of the phases, Ag3Sn, zeta-Ag4Sn, Ag, Ni3Sn4 and Ni3Sn phases. A preliminary thermodynamic model of the ternary system is developed based on the models of the three binary constituent systems without introducing any ternary interaction parameters. This ternary thermodynamic model is used with a commercial software Pandat to calculate the Sn-Ag-Ni 240 degreesC isothermal section. The phase relationships determined by calculation are consistent with those determined experimentally. Besides phase equilibria determination, the interfacial reactions between the Sn-Ag alloys with Ni substrate are investigated at 240, 300 and 400 degreesC, respectively. It is found that the phase formations in the Sn-3.5wt%Ag/Ni couples are very similar to those in the Sn/Ni couples. (C) 2004 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:2541 / 2547
页数:7
相关论文
共 18 条
[1]   Lead-free solders in microelectronics [J].
Abtew, M ;
Selvaduray, G .
MATERIALS SCIENCE & ENGINEERING R-REPORTS, 2000, 27 (5-6) :95-141
[2]  
BADER S, 1995, ACTA METALL MATER, V43, P329, DOI 10.1016/0956-7151(94)00224-6
[3]   FactSage thermochemical software and databases [J].
Bale, C ;
Chartrand, P ;
Degterov, SA ;
Eriksson, G ;
Hack, K ;
Ben Mahfoud, R ;
Melançon, J ;
Pelton, AD ;
Petersen, S .
CALPHAD-COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY, 2002, 26 (02) :189-228
[4]  
Blair HD, 1998, ELEC COMP C, P259
[5]   Interfacial reactions in the Sn-(Cu)/Ni, Sn-(Ni)/Cu, and Sn/(Cu,Ni) systems [J].
Chen, SW ;
Wu, SH ;
Lee, SW .
JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (11) :1188-1194
[6]   Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate [J].
Choi, WK ;
Lee, HM .
JOURNAL OF ELECTRONIC MATERIALS, 1999, 28 (11) :1251-1255
[7]   Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni [J].
Ho, CE ;
Tsai, RY ;
Lin, YL ;
Kao, CR .
JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (06) :584-590
[8]   Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization [J].
Jang, JW ;
Frear, DR ;
Lee, TY ;
Tu, KN .
JOURNAL OF APPLIED PHYSICS, 2000, 88 (11) :6359-6363
[9]   GROWTH-KINETICS OF INTERMETALLIC PHASES AT THE LIQUID SN AND SOLID NI INTERFACE [J].
KANG, SK ;
RAMACHANDRAN, V .
SCRIPTA METALLURGICA, 1980, 14 (04) :421-424
[10]  
Karakaya I., 1987, B ALLOY PHASE DIAGRA, V8, P340, DOI [DOI 10.1007/BF02869270, 10.1007/BF02869270]